|
Layer
Count
|
1-12
|
|
Board
Thickness (Min / Max)
|
---
|
|
Single
Sided
|
0.6
mm / 2.4 mm
|
|
Double
Sided Silver or Carbon Through Hole
|
0.6
mm / 1.6 mm
|
|
Double
Sided (PTH)
|
0.3
mm / 3.2 mm
|
|
4
Layer
|
0.6
mm / 3.2 mm
|
| 6
Layer + |
0.8
mm / 3.2 mm
|
|
Base
Laminate Copper Weight
|
17
um to 105 um
|
|
Base
Laminate Type
|
XPC,
FR1, FR2, CEM1, CEM3, FR4
(CTI-600, TG-170, Halogen Free on request)
|
|
Minimum
Line Width / Space
|
0.08
mm / 0.08 mm
|
|
Minimum
Hole Size (Finished)
|
---
|
|
Punching
Holes
|
0.7
mm
|
|
Silver
Paste Through Vias
|
0.6
mm
|
|
CNC
Drilled non plated
|
0.30
mm
|
|
CNC
Drilled plated
|
0.25
mm
|
|
Aspect
Ratio
|
10
|
|
Minimum
Annular Ring Size
|
0.25
mm greater than hole size
|
|
Finished
Board Size (Min / Max)
|
---
|
|
Minimum
|
50
mm x 50 mm
|
|
Maximum
|
457
mm x 609 mm
|
|
Avaliable
Finishes
|
---
|
|
HASL
|
Yes
|
|
OSP
(Entek or Flux)
|
Yes
|
|
Flash
Ni/Au (Hard Gold)
|
Yes
|
|
Gold
Finger
|
Yes
|
|
Others
|
Upon
Special Request
|
|
Production
Capacity per Month
|
---
|
|
Single
Sided
|
60,000
m2
|
|
Double
Sided Silver / Carbon Through Hole
|
20,000
m2
|
|
Double
Sided PTH
|
50,000
m2
|
|
Multi
Layer
|
30,000
m2
|
