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Prototype to high volume mass production |
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Single-Sided phenolic PCB to fine pitch
Multi Layer |
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Special finishes and processes available |
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| Material:
XPC, FR1, FR2, CEM1, CEM3,
FR4 |
| Finish:
Flux, Entek, HAL, Ni/Au |
| Application:
Audio/Video, Consumer Electronics,
and etc. |
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| Option:
Silver Paste through hole
/ Carbon Paste through hole |
| Surface
finish: Flux, Entek, HAL,
and etc |
| Technology:
Using a controlled print-process
to achieve |
| conductivity
of 2 sides of a PCB. No plating
is required. |
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| Line
and Space Width: Down to
4 mil |
| Material
: FR4, High Tg material,
and others available |
| Layer
Count: Up to 8 layers |
| Special
Finishes such as thick gold,
peelable soldermask and etc |
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